• Suitable for bonding and coating ceramic substrates
  • Ideal for casting applications in electronic assemblies
  • Ideal for conformal coating applications in electronic assemblies
  • Used in a wide range of aggressive liquids common in automotive applications applications requiring reliable protection
  • Perfect for applications requiring liquid polyol system with a dispersed solid encapsulated polyisocyanate material properties
  • Excellent for thermal management in power electronics and LED assemblies
  • Thermal conductivity of 0.16 to 0.20 W/m°K for efficient heat dissipation
  • Offers soft flexibility for mechanical stress management
  • High temperature resistance up to Excellent temperature cycling behaviour°C for demanding applications
  • Cures in 25 to 35 min @ 90°C
  • 60 to 70 min @ 80°C for efficient processing
  • Excellent chemical resistance for harsh environments
  • Excellent vibration and shock resistance for harsh environments
Availability:
Available on Order

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